Very hard, low-profile polishing pad with strong abrasive (heavy cut) properties. Polishing Pad has an open cell structure. Therefore, the cutting force is at the same level at all times.
Achieve the greatest performance in combination with polishing pastes with very high and high wear. Polishing pad for orbital machine, dual-action.
Thin polishing pad with a center air hole so that these pads can also be used on the rupes machines!